Continuous Quality
Validate printed circuit board assembly lines in just a few steps to ensure you’re bringing a high-quality product to market. Alternatively, perform accelerated aging tests to filter out latent defects and correct them during prototyping.
Verification of compliance with construction requirements according to IPC-A-610 LR standards for Class 2 and Class 3, along with customer-released technical specifications.
Non-destructive examination of metallographic joints through X-ray analysis to monitor solder rise levels or the volume and distribution of voids in critical areas.
Assessment of the cleanliness level of the production line, essential to prevent dendritic growth, which can lead to short circuits. This is especially important for products with protective coatings (conformal coatings).
Further assess the reliability of metallographic joints through metallographic techniques (cross-section) or pull and shear tests.
These techniques provide a comprehensive assessment of the device's lifespan when performed on both a 'new' sample and a sample that has undergone simulated aging cycles.
Morphological analysis
The detail that makes the difference
Thanks to SEM techniques (Scanning Electron Microscopy), it is possible to thoroughly investigate the surface morphology of any sample, achieving more than 100,000x magnification for unique levels of detail, such as wire bonding, silicon die, 'black pad' analysis, and more.
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TEST LIST
Chemical and morphological analysis
Adhesion test/h4>
IPC-TM-650 2.4.29 - Solder Mask - Adhesion to Flexible Circuits