ATC

Simulate your board's behavior over years within just a few weeks.

Prevent field returns and immediately discover how to optimize your product, significantly reducing costs.

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Reduction

time to market

Increased

reliability

Process

verification

OUR OFFER

PreventLab is equipped with 4 thermal shock chambers and 3 climate chambers to choose from for your qualifications in accordance with IPC SM-785 and IPC-9701.

Climate Chambers

Using a climate chamber allows you to assess the resistance and behavior of your product by exposing it to controlled temperature and humidity cycles.

Standards

We perform thermal shock tests according to:

IEC 60068-2-2
IEC 60068-2-14 test Nb
IEC 60068-2-30
Test Methods IPC-TM-650

Thermal Shock

The cycles are performed by moving the samples quickly and automatically from a hot chamber to a cold chamber. The thermal shock caused stresses the sample, quickly highlighting any critical issues present that would otherwise not be immediately detectable.

Technical features

The thermal shock chambers are all double-chambered inside and with an automatic basket. They can manage cycles from -70° (in cold chamber) to + 200° (in hot chamber)

Standards

We perform thermal shock tests according to:

IEC 60068-2-14 test Na
IPC-SM-785

LAT-Calibrated Chambers

We strive to ensure the quality of our testing.

Our chambers are calibrated by a LAT center, guaranteeing constant control over our machines' performance.

By acting preventively and optimizing processes, we not only verify component reliability over time but also reduce waste, scrap, CO₂ emissions, and costs.

SIR TEST

Surface Insulation Resistance (SIR), as defined by IPC TM-650 par. 2.6.3.3, measures the electrical resistance of an insulating material between pairs of contacts, conductors, or grounding devices under specified environmental and electrical conditions.

The images below illustrate examples of crystalline structures formed following the test execution.

What is SIR?

The SIR (Surface Insulation Resistance) test is a methodology used to characterize residues from the PCB manufacturing and electronic component assembly processes and their impact on reliability. It is typically performed on industry-standard test coupons containing models, often designed as interlocking comb test patterns for process testing purposes.

These models are exposed to a high temperature and humidity environment that mobilizes any surface contaminants and reduces the insulation resistance of the test specimen.

LCA - Life Cycle Assessment

Life Cycle Assessment (LCA) is a structured and internationally standardized method that quantifies the potential environmental and human health impacts associated with a good or service, starting from its resource consumption and emissions. This assessment considers all stages of a product's life cycle, including raw material extraction, production, transportation, use, and end-of-life disposal.

ATC

Reduction

time to market

Increased

reliability

Process

verification

OUR OFFER

Climate Chambers

Standards

Thermal Shock

Technical features

Standards

LAT-Calibrated Chambers

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SIR TEST

What is SIR?

LCA - Life Cycle Assessment

FAQ - PRODUCT PROCESS QUALIFICATION

What is the advantage of performing accelerated aging?

How is the accelerated aging method decided?

What is the maximum load capacity in kilograms of the automatic basket in the thermal shock chambers?

In the case of tests with powered samples, is there a minimum length required for the wiring?

Is there a limit to the number of samples that can be placed in the thermal shock chamber at the same time?

Is there a limit to the number of samples that can be placed in the climatic chamber at the same time?

Can the chambers record the parameters of the ongoing test?