TEST LIST

TEST LIST

Chemical and morphological analysis

Total Ionic Contamination (TIC)
IPC-TM-650 2.3.25 - Detection and Measurement of Ionizable Surface Contaminats by Resistivity of Solvent Extract (ROSE)
PCB Qualification, PCBA Qualification
Ion Chromatography (IC)
IPC-TM-650 2.3.28.2
PCB Qualification, PCBA Qualification
Energy-Dispersive Spectroscopy (EDS)
Internal method
SEM Analysis
Scanning Electron Microscope (SEM)
Internal method
SEM Analysis
Spectroscopy FT-IR
Internal method
Failure analysis

Adhesion test

Solder Mask Adhesion test
IPC-TM-650 2.4.28.1 - Solder Mask Adhesion - Tape test method
IPC-TM-650 2.4.29 - Solder Mask - Adhesion to Flexible Circuits
PCB Qualification, PCBA Qualification
Adhesion, Polymer Coating
IPC-TM-650 2.4.1.6 - Adhesion, Polymer Coating 07/95
Conformal Coating qualification
Adhesion (Paint and Related Coatings)
ASTM D3359
Conformal Coating qualification

PCB finishing thickness measurements

Immersion Silver Thickness
ASTM B568-98
PCB Qualification
Direct Immersion Gold (DIG) Thickness
ASTM B568-98
PCB Qualification
ENEPIG Thickness
ASTM B568-98
PCB Qualification
ENIG Thickness
ASTM B568-98
PCB Qualification
HASL (or HAL) Thickness
ASTM B568-98
PCB Qualification
HASL (SnPb) Thickness
ASTM B568-98
PCB Qualification
Immersion Tin
ASTM B568-98
PCB Qualification

Material analysis (physical/mechanical charatterization)

TGA (Thermogravimetric analysis)
Internal method
PCB Qualification
TMA (Thermomechanical analysis)
Internal method
PCB Qualification
DMA (Dynamic Mechanical Analysis)
Internal method
PCB Qualification
Time to delamination
IPC-TM-650 2.4.24.1 - Time to Delamination (TMA)
PCB Qualification
Decomposition temperature
IPC-TM-650 2.4.24.6 - Decomposition Temperature (Td) of Laminate Material Using TGA
PCB Qualification
Tg and CTE (axis z)
IPC-TM-650 2.4.24 / 2.4.24.5 - Tg and CTE (z-axis)
PCB Qualification
Tg and Modulus (E)
IPC-TM-650 2.4.24.4 - Glass Transition and Modulus (DMA)
PCB Qualification

component analysis

Wettability test (Edge Dip or Wetting Balance)
IPC-J-STD-002 (Edge Dip e Wetting Balance)
Components qualification
Remarking
AS6081
Components qualification
Resurfacing
AS6081
Components qualification
Sn/Ni/Cu finishing thickness
ASTM B568-98
Components qualification
Scanning Acustic Microscope (SAM)
IPC/JEDEC J-STD-035
Components qualification
Decapsulation
Internal method
Components qualification

PCB charaterization

Bow & Twist
IPC-TM-650 2.4.22 - Bow & Twist (%)
PCB Qualification
Moisture Absorption Rate (%)
IPC-TM-650 2.6.28 - Moisture Content / Moisture Absorption Rate in PCB
PCB Qualification
Visual inspection
IPC-A-600
PCB Qualification
V-cut thickness
Internal method
PCB Qualification
Thermal Stress, Convection Reflow Assembly simulation
IPC-TM-650 2.6.27 - Thermal Stress, Convection Reflow Assembly simulation
PCB Qualification
Thermal Stress of Laminates
IPC-TM-650 2.4.13.1 - Thermal Stress of Laminates
PCB Qualification
Thermal Stress PTH
IPC-TM-650 2.6.8 - Thermal Stress, Plated-Through Holes
PCB Qualification
Micrographic test
IPC-TM-650 2.1.1 - Microsectioning
PCB Qualification
Dimensional inspection on microsection
IPC-TM-650 2.2.5 - Dimensional Inspection
PCB Qualification
Solderability test (Edge dip or Wetting balance)
IPC-J-STD-003
PCB Qualification
Dyne, pen
Internal method + IPC-HDBK-830
PCB Qualification

PCBA charaterization

Visual inspection
IPC-A-610
PCBA Qualification
X-ray
Internal method
PCBA Qualification
X-ray - void calculation
IPC-A-610, IPC-7095 (BGA)
PCBA Qualification
Micrographic test
IPC-TM-650 2.1.1 - Microsectioning
PCBA Qualification
Optical inspection on microsection
Internal method
PCBA Qualification
Dye and Pry
IPC-TM-650 2.4.53 - Dye and Pull Test Method
PCBA Qualification
Pull strength test
IEC 62137-1-1 - Pull strength test
PCBA Qualification
Shear strength test
IEC 62137-1-2 - Shear strength test
PCBA Qualification
Zestron Coating Layer
Internal method
PCBA Qualification
Zestron Flux
Internal method
PCBA Qualification
Zestron Resin
Internal method
PCBA Qualification

Stress test

Salt mist
ASTM 117-07A & IEC 60068-2-11, Test Ka
Components qualification
Thermal cycles
IEC 60068-2-14, Test Nb
Components qualification
Thermal shock cycles
IEC 60068-2-14, Test Na
Components qualification
Thermal Shock (CC)
IPC-TM-650 2.6.7.1 - Thermal Shock – Conformal Coating
Components qualification
Thermal Shock (PCB)
IPC-TM-650 2.6.7.2 - Thermal Shock, Thermal Cycle and Continuity
Components qualification
Dry Heat
IEC 60068-2-2, Test B
Components qualification
Damp Heat (CC)
IPC-TM-650 2.6.3.4 - Moisture and Insulation Resistance – Conformal Coating
Components qualification
Damp Heat, cyclic
IEC 60068-2-30, Test Db
Components qualification
Damp Heat (SIR)
IPC-TM-650 2.6.3.3 / 2.6.3.7
Components qualification
Damp Heat, static
IEC 60068-2-78
Components qualification
Laboratorio