PRINTED CIRCUIT BOARD
QUALIFICATION

Validate the printed circuit board (PCB) supply lines in just a few steps to bring a flawlessly manufactured product to market.
Carry out regular checks to identify any variations or deviations in the process.

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Continuous Quality

PreventLab is by your side to help you avoid production line downtime with frequent quality checks on the most critical products. The Printed Circuit Board is the indispensable foundation of the electronic assembly; it is essential to ensure that the quality standards are as desired.


Verification of compliance with construction requirements according to IPC-A-600 LR Class 2, Class 3 standards along with technical specifications released by the customer.

Examination of the durability of the PCB even after multiple thermal stresses to simulate soldering phases and compatibly with the moisture absorption experienced by the product.

Assessment of the cleanliness level of the production line; the PCB production process is long and complex.

It involves the use of aggressive chemicals (e.g., plating baths) and mechanical removal of debris (drilling); therefore, if the product is not adequately cleaned, it may carry latent defects.

Analysis of the thickness and characteristics of the metallic and organic surface finish to ensure proper wettability and formation of the metallurgical joint.

Additionally, it is useful to evaluate the melting point of the tin alloy (HALS) to control potential copper contaminations.

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TEST LIST

Chemical and morphological analysis

Total Ionic Contamination (TIC)
IPC-TM-650 2.3.25 - Detection and Measurement of Ionizable Surface Contaminats by Resistivity of Solvent Extract (ROSE)
Ion Chromatography (IC)
IPC-TM-650 2.3.28.2

Adhesion test

Solder Mask Adhesion test
IPC-TM-650 2.4.28.1 - Solder Mask Adhesion - Tape test method
IPC-TM-650 2.4.29 - Solder Mask - Adhesion to Flexible Circuits

PCB finishing thickness measurements

Immersion Silver Thickness
ASTM B568-98
Direct Immersion Gold (DIG) Thickness
ASTM B568-98
ENEPIG Thickness
ASTM B568-98
ENIG Thickness
ASTM B568-98
HASL (or HAL) Thickness
ASTM B568-98
HASL (SnPb) Thickness
ASTM B568-98
Immersion Tin
ASTM B568-98

Material analysis (physical/mechanical charatterization)

TGA (Thermogravimetric analysis)
Internal method
TMA (Thermomechanical analysis)
Internal method
DMA (Dynamic Mechanical Analysis)
Internal method
Time to delamination
IPC-TM-650 2.4.24.1 - Time to Delamination (TMA)
Decomposition temperature
IPC-TM-650 2.4.24.6 - Decomposition Temperature (Td) of Laminate Material Using TGA
Tg and CTE (axis z)
IPC-TM-650 2.4.24 / 2.4.24.5 - Tg and CTE (z-axis)
Tg and Modulus (E)
IPC-TM-650 2.4.24.4 - Glass Transition and Modulus (DMA)

PCB charaterization

Bow & Twist
IPC-TM-650 2.4.22 - Bow & Twist (%)
Moisture Absorption Rate (%)
IPC-TM-650 2.6.28 - Moisture Content / Moisture Absorption Rate in PCB
Visual inspection
IPC-A-600
V-cut thickness
Internal method
Thermal Stress, Convection Reflow Assembly simulation
IPC-TM-650 2.6.27 - Thermal Stress, Convection Reflow Assembly simulation
Thermal Stress of Laminates
IPC-TM-650 2.4.13.1 - Thermal Stress of Laminates
Thermal Stress PTH
IPC-TM-650 2.6.8 - Thermal Stress, Plated-Through Holes
Micrographic test
IPC-TM-650 2.1.1 - Microsectioning
Dimensional inspection on microsection
IPC-TM-650 2.2.5 - Dimensional Inspection
Solderability test (Edge dip or Wetting balance)
IPC-J-STD-003
Dyne, pen
Internal method + IPC-HDBK-830