X-RAY ANALISYS

Complete the visual inspection by checking the soldering condition and any anomalies in the areas not directly accessible in your electronic assembly.

Verify the assembly condition of your device before its market release to prevent malfunctions and returns from the field.

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Control

assembly proces

Qualification

solder paste

Prevention

failures

OUR OFFER

PreventLab is equipped with top-of-the-line equipment from Nordson Dage.

nordson x3

NORDSON X3#

MatriX X3# is an automated inspection system designed for sophisticated high-speed inspections in SMT production.

Teconologies:

Slice-Filter-Technique (SFT)
Patented X-ray technology.

Off-Axis e 3D SART
They represent a reliable solution for inline inspection of double-sided PCB assemblies.

The mobile detector's axes allow for high-speed off-axis image acquisition from various angles and directions with maximum image quality and resolution.

quadra 7

QUADRA 7

The machine has a resolution of 0.1 µm/pixel and allows for acquisitions in four different modes:

2D Inspection
This is a very fast analysis conducted in real-time. It provides a general overview of the soldering condition and allows for a closer examination of details such as menisci and joint shapes..

This type of analysis is sufficient to diagnose macro-defects such as short or open conditions. It also enables the calculation of the fill percentage of PTH joints and voids in the alloy.

3D Laminography
This allows for a more detailed 3D reconstruction compared to traditional 2D inspection.

It enables virtual micro-sectioning and serves as a good compromise between 2D inspection and tomography (where sample size might become problematic). Again, this analysis is sufficient to identify macro-defects.

Tomography
This type of analysis allows for a very detailed 3D reconstruction. It enables virtual micro-sectioning to identify both macro and micro-defects.

It is suitable for small samples; if the samples exceed the size of the support, they would need to be evaluated for reduction through cutting.

Heated Stage
This allows for the application of a thermal profile during X-ray analysis, simulating reflow in four stages.

It enables observation of how the metallurgical joint changes in response to the applied heat. In this case, the dimensional constraint is determined by the sample holder chamber (oven).

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Examples

FAQ - X-RAY ANALISYS

Yes, X-rays allow access to the internal structure of components, such as the junction of a diode, the metal frame of a die, or the wire bonding of an integrated circuit.

Yes, to check the integrity of the traces (open/short) and the copper planes, provided that the PCB layout and the overlapping conductors allow for it.

Generally, it is not; only in the case of large samples undergoing tomography is there a dimensional constraint for the sample holder of 4x8 cm. However, in these cases, the situation can be resolved through laminography, which still provides a 3D reconstruction, albeit with less detail, but is often still capable of identifying the issue.

Yes, the maximum allowed weight is 5 kg.

It's not always possible to detect such small distances, but the machine allows for the detector's tilt angle to be changed up to 270° to enable analysis from different angles. If I can't clearly identify a defect, I can still locate a suspicious area to analyze using more detailed techniques (such as a micro-section).

The machine allows for adjustments in working voltages and currents, enabling the analysis of non-metallic materials as well.